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NSN Part MA4PH233 with NSN 5961-01-445-9113 by M A Com Inc - Fill RFQ Form

Mfg Part Number: MA4PH233 Manufacturer: M A Com Inc
NSN : 5961-01-445-9113 NIIN : 014459113
Item Name : semiconductor devic CAGE Code : 1HJ31
FSC : 5961 Semiconductor Devices and Associated Hardware

Thank you for your interest in our available MA4PH233 NSN part. This part number MA4PH233 is a Semiconductor Devic listed under the FSC 5961 Semiconductor Devices and Associated Hardware, and it is manufactured by M A Com Inc. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational

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Internet of Components is a premier supplier of MA4PH233 NSN component, and we carry recently requested NSN components such as 5961014459113. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as M A Com Inc. If you are interested in this particular item, we invite you to begin the purchasing process for MA4PH233 today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.

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NSN Information for Part Number MA4PH233 with NSN 5961-01-445-9113, 5961014459113

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5961-01-445-9113

Item Description:

Semiconductor Devic

59610144591130NA
CIICHCCESDPMICCriticalityENAC
UAA0
Part NumberISCRNVCRNCCHCCMSDSSADC
MA4PH233593

Characteristics Data of NSN 5961-01-445-9113, 5961014459113

MRCCriteriaCharacteristic
ABHPOVERALL LENGTH0.140 INCHES MAXIMUM
CTQNVOLTAGE RATING IN VOLTS PER CHARACTERISTIC500.0 MINIMUM BREAKDOWN VOLTAGE, DC
TTQYTERMINAL TYPE AND QUANTITY2 BONDING PAD
ABMKOVERALL WIDTH0.095 INCHES MAXIMUM
CTMZSEMICONDUCTOR MATERIALSILICON
AXGYMOUNTING METHODTERMINAL
ABBHINCLOSURE MATERIALCERAMIC

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