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NSN Part SD1379-H2 with NSN 5961-01-062-5743 by Microsemi Corp - Fill RFQ Form

Mfg Part Number: SD1379-H2 Alternate P/N: SD1379H2
Manufacturer: Microsemi Corp NSN : 5961-01-062-5743
NIIN : 010625743 Item Name : transistor
CAGE Code : 08JA0 FSC : 5961 Semiconductor Devices and Associated Hardware

Thank you for your interest in our available SD1379-H2 NSN part. This part number SD1379-H2 is a Transistor listed under the FSC 5961 Semiconductor Devices and Associated Hardware, and it is manufactured by Microsemi Corp. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational

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Internet of Components is a premier supplier of SD1379-H2 NSN component, and we carry recently requested NSN components such as 5961010625743. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as Microsemi Corp. If you are interested in this particular item, we invite you to begin the purchasing process for SD1379-H2 today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.

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NSN Information for Part Number SD1379-H2 with NSN 5961-01-062-5743, 5961010625743

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5961-01-062-5743

Item Description:

Transistor

59610106257430NB
CIICHCCESDPMICCriticalityENAC
UBG
Part NumberISCRNVCRNCCHCCMSDSSADC
SD1379-H2225

Characteristics Data of NSN 5961-01-062-5743, 5961010625743

MRCCriteriaCharacteristic
ABBHINCLOSURE MATERIALCERAMIC AND METAL
ABHPOVERALL LENGTH0.640 INCHES NOMINAL
AKPVMOUNTING FACILITY QUANTITY1
ALASINTERNAL CONFIGURATIONJUNCTION CONTACT
AXGYMOUNTING METHODTHREADED STUD
CQJXNOMINAL THREAD SIZE0.164 INCHES
CTMZIII SEMICONDUCTOR MATERIALSILICON
CTQNVOLTAGE RATING IN VOLTS PER CHARACTERISTIC55.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND 33.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN AND 3.5 MAXIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN
CTQXCURRENT RATING PER CHARACTERISTIC250.00 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM
CTRDPOWER RATING PER CHARACTERISTIC5.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET
CTSGMAXIMUM OPERATING TEMP PER MEASUREMENT POINT200.0 DEG CELSIUS JUNCTION
FEATSPECIAL FEATURESCERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; JUNCTION PATTERN ARRANGEMENT: NPN
PMLCPRECIOUS MATERIAL AND LOCATIONCHIP METALLIZATION AND INTERNAL @WIRES GOLD
PRMTPRECIOUS MATERIALGOLD
TESTTEST DATA DOCUMENT13499-352-1059 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA
THSDTHREAD SERIES DESIGNATORUNC
TTQYTERMINAL TYPE AND QUANTITY4 RIBBON

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